A plating apparatus capable of controlling the electric current of individual jigs

A plating apparatus capable of controlling the electric current of individual jigs

The present invention relates to a plating apparatus capable of controlling the electric current of individual jigs, and more particularly, to a plating apparatus capable of controlling the electric current of individual jigs such that a plating layer having a uniform thickness is formed on a substr...

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1. Verfasser: BAE, MIN-SU
Format: Patent
Sprache:chi ; eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator BAE, MIN-SU
description The present invention relates to a plating apparatus capable of controlling the electric current of individual jigs, and more particularly, to a plating apparatus capable of controlling the electric current of individual jigs such that a plating layer having a uniform thickness is formed on a substrate held by the jig. The plating apparatus capable of controlling the electric current of individual jigs, according to the present invention, comprises: a continuous plating line having first anodes; a stepwise plating line disposed behind the continuous plating line and provided with second anodes; and a control unit for regulating values of the electric current applied to the first and second anodes such that the final plating thickness to be formed on a substrate is kept uniform, wherein in the continuous plating line, plating is performed while the substrate is moved; in the stepwise plating line, plating is performed while the substrate is stopped; and the control unit maintains the values of the electric cur
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title A plating apparatus capable of controlling the electric current of individual jigs
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