A plating apparatus capable of controlling the electric current of individual jigs
The present invention relates to a plating apparatus capable of controlling the electric current of individual jigs, and more particularly, to a plating apparatus capable of controlling the electric current of individual jigs such that a plating layer having a uniform thickness is formed on a substr...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present invention relates to a plating apparatus capable of controlling the electric current of individual jigs, and more particularly, to a plating apparatus capable of controlling the electric current of individual jigs such that a plating layer having a uniform thickness is formed on a substrate held by the jig. The plating apparatus capable of controlling the electric current of individual jigs, according to the present invention, comprises: a continuous plating line having first anodes; a stepwise plating line disposed behind the continuous plating line and provided with second anodes; and a control unit for regulating values of the electric current applied to the first and second anodes such that the final plating thickness to be formed on a substrate is kept uniform, wherein in the continuous plating line, plating is performed while the substrate is moved; in the stepwise plating line, plating is performed while the substrate is stopped; and the control unit maintains the values of the electric cur |
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