Cover tape for packing electronic component and package
The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and is sealed to a carrier tape including a plurality of storage parts for storing the electronic component, and an...
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| creator | INOUE, MASAKUNI NAGATSUKA, YASUNORI YANAGISAWA, SHUNPEI |
| description | The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and is sealed to a carrier tape including a plurality of storage parts for storing the electronic component, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface, wherein a surface resistivity of the surface side where the antistatic layer is placed is 1.0 * 1010 [Omega]/□ or less, after a moist-heat load of storing for 100 hours under moist-heat environment of 40 DEG C and 95%RH; a sealing strength to the carrier tape before the moist-heat load is 0.7 N or less; and a sealing strength to the carrier tape after the moist-heat load is 0.1 N or more. |
| format | Patent |
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a sealing strength to the carrier tape before the moist-heat load is 0.7 N or less; and a sealing strength to the carrier tape after the moist-heat load is 0.1 N or more.</description><language>chi ; eng</language><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS ; CONVEYING ; HANDLING THIN OR FILAMENTARY MATERIAL ; PACKAGES ; PACKAGING ELEMENTS ; PACKING ; PERFORMING OPERATIONS ; STORING ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211216&DB=EPODOC&CC=TW&NR=202146305A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211216&DB=EPODOC&CC=TW&NR=202146305A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>INOUE, MASAKUNI</creatorcontrib><creatorcontrib>NAGATSUKA, YASUNORI</creatorcontrib><creatorcontrib>YANAGISAWA, SHUNPEI</creatorcontrib><title>Cover tape for packing electronic component and package</title><description>The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and is sealed to a carrier tape including a plurality of storage parts for storing the electronic component, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface, wherein a surface resistivity of the surface side where the antistatic layer is placed is 1.0 * 1010 [Omega]/□ or less, after a moist-heat load of storing for 100 hours under moist-heat environment of 40 DEG C and 95%RH; a sealing strength to the carrier tape before the moist-heat load is 0.7 N or less; and a sealing strength to the carrier tape after the moist-heat load is 0.1 N or more.</description><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR</subject><subject>CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS</subject><subject>CONVEYING</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>PACKAGES</subject><subject>PACKAGING ELEMENTS</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>STORING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB3zi9LLVIoSSxIVUjLL1IoSEzOzsxLV0jNSU0uKcrPy0xWSM7PLcjPS80rUUjMSwErSExP5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcVAVal5qSXxIeFGBkaGJmbGBqaOxsSoAQDEIy3n</recordid><startdate>20211216</startdate><enddate>20211216</enddate><creator>INOUE, MASAKUNI</creator><creator>NAGATSUKA, YASUNORI</creator><creator>YANAGISAWA, SHUNPEI</creator><scope>EVB</scope></search><sort><creationdate>20211216</creationdate><title>Cover tape for packing electronic component and package</title><author>INOUE, MASAKUNI ; NAGATSUKA, YASUNORI ; YANAGISAWA, SHUNPEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202146305A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR</topic><topic>CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS</topic><topic>CONVEYING</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>PACKAGES</topic><topic>PACKAGING ELEMENTS</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>STORING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>INOUE, MASAKUNI</creatorcontrib><creatorcontrib>NAGATSUKA, YASUNORI</creatorcontrib><creatorcontrib>YANAGISAWA, SHUNPEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>INOUE, MASAKUNI</au><au>NAGATSUKA, YASUNORI</au><au>YANAGISAWA, SHUNPEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cover tape for packing electronic component and package</title><date>2021-12-16</date><risdate>2021</risdate><abstract>The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and is sealed to a carrier tape including a plurality of storage parts for storing the electronic component, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface, wherein a surface resistivity of the surface side where the antistatic layer is placed is 1.0 * 1010 [Omega]/□ or less, after a moist-heat load of storing for 100 hours under moist-heat environment of 40 DEG C and 95%RH; a sealing strength to the carrier tape before the moist-heat load is 0.7 N or less; and a sealing strength to the carrier tape after the moist-heat load is 0.1 N or more.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING |
| title | Cover tape for packing electronic component and package |
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