Cover tape for packing electronic component and package

Cover tape for packing electronic component and package

The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and is sealed to a carrier tape including a plurality of storage parts for storing the electronic component, and an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: INOUE, MASAKUNI, NAGATSUKA, YASUNORI, YANAGISAWA, SHUNPEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
STORING
TRANSPORTING
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Beschreibung
Zusammenfassung:The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and is sealed to a carrier tape including a plurality of storage parts for storing the electronic component, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface, wherein a surface resistivity of the surface side where the antistatic layer is placed is 1.0 * 1010 [Omega]/□ or less, after a moist-heat load of storing for 100 hours under moist-heat environment of 40 DEG C and 95%RH; a sealing strength to the carrier tape before the moist-heat load is 0.7 N or less; and a sealing strength to the carrier tape after the moist-heat load is 0.1 N or more.