Electrostatic chuck device and sleeve for electrostatic chuck device

An electrostatic chuck device comprises a substrate, a stack stacked on an upper surface of the substrate in a thickness direction, and a ceramics layer stacked on an upper surface of the stack in the thickness direction. A sleeve made of an insulating material is inserted into a through-hole penetrating through the substrate and the stack in the thickness direction. An upper surface of the sleeve in the thickness direction has a dual-level structure including a first upper surface positioned on the same plane as an upper surface of the substrate in the thickness direction, and a second upper surface positioned higher than the first upper surface in the thickness direction of the sleeve and disposed in proximity to the ceramics layer. In a plan view, an edge portion of the stack is disposed over the first upper surface.