Integrated chip and method of designing and manufacturing the same

Integrated chip and method of designing and manufacturing the same

An integrated chip includes a semiconductor substrate including a first active device area, a second active device area, and a dummy device area that extends between the first active device area and the second active device area. The integrated chip also includes a first array of linear features ext...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HSIEH, TUNG-HENG, YOUNG, BAO-RU, LEE, TZUNGI, CHANG, YU-JUNG, HSU, CHUNIA, CHANG, YUNG-FENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated chip includes a semiconductor substrate including a first active device area, a second active device area, and a dummy device area that extends between the first active device area and the second active device area. The integrated chip also includes a first array of linear features extending over the first active device area and having a first line spacing and a first line width. The integrated chip also includes a second array of linear features extending over the second active device area and having a second line spacing and a second line width. The integrated chip also includes a dummy device structure disposed on the dummy device area and extending over a substantial portion of the dummy device area. The dummy device structure is a third array of linear features having the first line spacing and the first line width.