Wiring circuit board and method for manufacturing same

A method for manufacturing a wiring circuit board 1 comprising: a first step for forming a base insulation layer 7 on one thickness-direction surface of a metal sheet 25; a second step for forming a conductor layer 8 on one thickness-direction surface of the base insulation layer 7 so that a width W...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ITO, MASAKI, TAKAKURA, HAYATO, KAKIUCHI, RYOHEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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