Wiring circuit board and method for manufacturing same

A method for manufacturing a wiring circuit board 1 comprising: a first step for forming a base insulation layer 7 on one thickness-direction surface of a metal sheet 25; a second step for forming a conductor layer 8 on one thickness-direction surface of the base insulation layer 7 so that a width W3 of a wiring 16 is less than a width W2 of a wiring body base part 13; a third step for forming a cover insulation layer 9 on one thickness-direction surface exposed from the wiring 16 in the wiring body base part 13 so as to cover the wiring 16, and so that a width W4 of a wiring body cover part 19 is less than the width W2 of the wiring body base part 13; and a fourth step for etching the metal sheet 25 from both thickness-direction sides, and forming a metal support layer 6 so that a width W1 of a wiring body metal part 10 is less than the width W2 of the wiring body base part 13.