Novel pad-in-a-bottle (PIB) technology for advanced chemical-mechanical planarization (CMP) slurries and processes

A novel pad-in-a-bottle (PIB) technology for advanced chemical-mechanical planarization (CMP) slurries, systems and processes has been disclosed. The role of conventional polishing pad asperities is played by high-quality micron-size polyurethane (PU) beads that are comparable to the sizes of pores...

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Bibliographische Detailangaben
Hauptverfasser:	PHILIPOSSIAN, ARA, LANGAN, JOHN G, SHI, XIAOBO, O'NEILL, MARK LEONARD, SAMPURNO, YASA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	A novel pad-in-a-bottle (PIB) technology for advanced chemical-mechanical planarization (CMP) slurries, systems and processes has been disclosed. The role of conventional polishing pad asperities is played by high-quality micron-size polyurethane (PU) beads that are comparable to the sizes of pores and asperities in polishing pads.