Cover tape for packing electronic component and package

The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	INOUE, MASAKUNI, NAGATSUKA, YASUNORI, YANAGISAWA, SHUNPEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface, wherein a surface resistivity measured from the antistatic layer side of the cover tape is 1 * 1010 [Omega]/□ or less, after a moist-heat load of storing a package using a carrier tape for 24 hours under environment of 60 DEG C and 95%RH; and a surface tack force measured from the heat sealing layer side of the cover tape is 5 gf or less, after a moist-heat load of storing a package using a carrier tape for 24 hours under environment of 60 DEG C and 95%RH.