Roll-up circuit board

Roll-up circuit board

A roll-up circuit board includes a flexible substrate, a patterned metal layer and at least one stiffener. The patterned metal layer has a first pattern and a second pattern, and a gap not smaller than 50 [mu]m exists between the first and second patterns. The stiffener is located between the first...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HUANG, PIN-XIAN, WU, KUO-HSUAN, LEE, SHIHUAN, WEI, CHAOING
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A roll-up circuit board includes a flexible substrate, a patterned metal layer and at least one stiffener. The patterned metal layer has a first pattern and a second pattern, and a gap not smaller than 50 [mu]m exists between the first and second patterns. The stiffener is located between the first and second patterns for enhancing bending strength of the flexible substrate under and between the first and second patterns. Consequently, the first and second patterns are protected from damage, caused by the flexible substrate, while the circuit board is rolled up and are available for optical sensing.