A measurement apparatus and a method for determining a substrate grid

A measurement apparatus (10) and method for determining a substrate grid describing a deformation of a substrate (12) prior to exposure of the substrate (12) in a lithographic apparatus (LA) configured to fabricate one or more features on the substrate (12). Position data for a plurality of first fe...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SOCHA, ROBERT JOHN, ZHANG, YOUPING, MEGENS, HENRICUS JOHANNES LAMBERTUS, BIJNEN, FRANCISCUS GODEFRIDUS CASPER, HULSEBOS, EDO MARIA
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A measurement apparatus (10) and method for determining a substrate grid describing a deformation of a substrate (12) prior to exposure of the substrate (12) in a lithographic apparatus (LA) configured to fabricate one or more features on the substrate (12). Position data for a plurality of first features and/or a plurality of second features on the substrate (12) is obtained. Asymmetry data for at least a feature of the plurality of first features and/or the plurality of second features is obtained. The substrate grid based on the position data and the asymmetry data is determined. The substrate grid and asymmetry data are passed to the lithographic apparatus LA for controlling at least part of an exposure process to fabricate one or more features on the substrate (12).