Resin composition, resin sheet, prepreg, and printed wiring board

To provide: a resin composition with which excellent low permittivity properties, low dielectric dissipation properties, flexibility, and peel strength can be obtained; a resin sheet; a prepreg; and a printed wiring board. A resin composition containing: a maleimide compound (A) that exhibits a relative permittivity of less than 2.7; a polyphenylene ether compound (B) that is represented by general formula (1) and has a number-average molecular weight of 1,000 to 7,000; and a block copolymer (C) that has a styrene skeleton. In general formula (1), X represents an aryl group, -(Y-O)n2- represents a polyphenylene ether moiety, R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n2 represents an integer of 1-100, n1 represents an integer from 1 to 6, and n3 represents an integer from 1 to 4.