Resin sheet and circuit board material using the same

The present invention addresses the problem of providing a resin sheet having low dielectric properties, and a circuit board material using the same. A resin sheet according to one embodiment of the present invention has at least a resin layer (A) containing a cyclic polyolefin resin copolymer, the...

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Bibliographische Detailangaben
Hauptverfasser:	ISHIHARA, TOSHIHISA, SANO, JIRO, HAYAKAWA, YUUKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention addresses the problem of providing a resin sheet having low dielectric properties, and a circuit board material using the same. A resin sheet according to one embodiment of the present invention has at least a resin layer (A) containing a cyclic polyolefin resin copolymer, the crystal melting peak temperature of which is less than 100 DEG C, and exhibits a dielectric loss tangent at 12GHz of less than 0.005.