Package comprising a substrate having a via wall configured as a shield

Package comprising a substrate having a via wall configured as a shield

A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located...

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Bibliographische Detailangaben
Hauptverfasser: HAN, JEA-HYEONG, YEON, JAE-HYUN, ZHANG, CHAO-QI, JESSIE, DARRYL SHELDON, WENG, LI-SHENG, CHEN, XIAOMING, KUMAR, RAJNEESH, HWANG, SUH-YUNG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.