Adhesive composition and connecting construct including a first circuit component, a second circuit component, and a connection part arranged between the first circuit component and the second circuit component
One aspect of the present invention is a connection construct, which includes: a first circuit component having a first electrode; a second circuit component having a second electrode; and a connection part arranged between the first circuit component and the second circuit component, and connecting...
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| creator | SHINOHARA, KENGO MORIJIRI, TOMOKI MATSUKAWA, AYAO |
| description | One aspect of the present invention is a connection construct, which includes: a first circuit component having a first electrode; a second circuit component having a second electrode; and a connection part arranged between the first circuit component and the second circuit component, and connecting electrically the first electrode and the second electrode with each other; wherein at least one of the first electrode and the second electrode has a layer made of copper (Cu) or silver (Ag) on the outermost surface, and the connection part includes a layer of conductive particles made of palladium (Pd) or gold (Au) on the outermost surface. |
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MORIJIRI, TOMOKI ; MATSUKAWA, AYAO</creatorcontrib><description>One aspect of the present invention is a connection construct, which includes: a first circuit component having a first electrode; a second circuit component having a second electrode; and a connection part arranged between the first circuit component and the second circuit component, and connecting electrically the first electrode and the second electrode with each other; wherein at least one of the first electrode and the second electrode has a layer made of copper (Cu) or silver (Ag) on the outermost surface, and the connection part includes a layer of conductive particles made of palladium (Pd) or gold (Au) on the outermost surface.</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CONDUCTORS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; 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a second circuit component having a second electrode; and a connection part arranged between the first circuit component and the second circuit component, and connecting electrically the first electrode and the second electrode with each other; wherein at least one of the first electrode and the second electrode has a layer made of copper (Cu) or silver (Ag) on the outermost surface, and the connection part includes a layer of conductive particles made of palladium (Pd) or gold (Au) on the outermost surface.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjTEOwjAMRbswIOAOYQcJWmCvEIgDVGKsTOK2looTJS7ckxORAmKiEpPt__3fHyeP3DQY6IZK26uzgYQsK2ATb2bUQlz3axDfaVHEuu1Mr4GqyAdRmrzuSN5xRpZFtALGiPnpRRm-7FjlwIsC74FrNOqCckdkJQ0O8V-I3h8qmSajCtqAs8-cJPPjodifluhsicGBRkYpi3O6StfZbrPd5Nk_P08z-WkV</recordid><startdate>20211001</startdate><enddate>20211001</enddate><creator>SHINOHARA, KENGO</creator><creator>MORIJIRI, TOMOKI</creator><creator>MATSUKAWA, AYAO</creator><scope>EVB</scope></search><sort><creationdate>20211001</creationdate><title>Adhesive composition and connecting construct including a first circuit component, a second circuit component, and a connection part arranged between the first circuit component and the second circuit component</title><author>SHINOHARA, KENGO ; MORIJIRI, TOMOKI ; MATSUKAWA, AYAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202136454A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>SHINOHARA, KENGO</creatorcontrib><creatorcontrib>MORIJIRI, TOMOKI</creatorcontrib><creatorcontrib>MATSUKAWA, AYAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHINOHARA, KENGO</au><au>MORIJIRI, TOMOKI</au><au>MATSUKAWA, AYAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Adhesive composition and connecting construct including a first circuit component, a second circuit component, and a connection part arranged between the first circuit component and the second circuit component</title><date>2021-10-01</date><risdate>2021</risdate><abstract>One aspect of the present invention is a connection construct, which includes: a first circuit component having a first electrode; a second circuit component having a second electrode; and a connection part arranged between the first circuit component and the second circuit component, and connecting electrically the first electrode and the second electrode with each other; wherein at least one of the first electrode and the second electrode has a layer made of copper (Cu) or silver (Ag) on the outermost surface, and the connection part includes a layer of conductive particles made of palladium (Pd) or gold (Au) on the outermost surface.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
| title | Adhesive composition and connecting construct including a first circuit component, a second circuit component, and a connection part arranged between the first circuit component and the second circuit component |
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