Adhesive composition and connecting construct including a first circuit component, a second circuit component, and a connection part arranged between the first circuit component and the second circuit component

Adhesive composition and connecting construct including a first circuit component, a second circuit component, and a connection part arranged between the first circuit component and the second circuit component

One aspect of the present invention is a connection construct, which includes: a first circuit component having a first electrode; a second circuit component having a second electrode; and a connection part arranged between the first circuit component and the second circuit component, and connecting...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHINOHARA, KENGO, MORIJIRI, TOMOKI, MATSUKAWA, AYAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
CONDUCTORS
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:One aspect of the present invention is a connection construct, which includes: a first circuit component having a first electrode; a second circuit component having a second electrode; and a connection part arranged between the first circuit component and the second circuit component, and connecting electrically the first electrode and the second electrode with each other; wherein at least one of the first electrode and the second electrode has a layer made of copper (Cu) or silver (Ag) on the outermost surface, and the connection part includes a layer of conductive particles made of palladium (Pd) or gold (Au) on the outermost surface.