Integrated metrology system
The present application discloses an integrated metrology system for evaluating semiconductor wafers, which includes: a main body, the main body may have a back side and a front side, the front side defines the front boundary of the main body; detachable support(s) unit that is detachably coupled to...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present application discloses an integrated metrology system for evaluating semiconductor wafers, which includes: a main body, the main body may have a back side and a front side, the front side defines the front boundary of the main body; detachable support(s) unit that is detachably coupled to the main body and supports the main body while extending to the outside of the front boundary; and auxiliary support unit(s) that is configured to be detachable without one or more support the main body in the case of the support unit. |
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