Composite copper member having voids

Provided is a composite copper member in which a copper-oxide-containing layer is formed on at least part of the surface of a copper member, the composite copper member being such that voids are present in the copper-oxide-containing layer.

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Bibliographische Detailangaben
Hauptverfasser:	SATO, MAKIKO, KOKAJI, YOSHINOBU, OBATA, NAOKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a composite copper member in which a copper-oxide-containing layer is formed on at least part of the surface of a copper member, the composite copper member being such that voids are present in the copper-oxide-containing layer.