Two component (2K) curable adhesive composition

The present invention is directed to a curable and debondable two-part (2K) hybrid adhesive composition comprising: (i) a first part comprising: (a) epoxy resin; (b) (meth)acrylate monomer; (c) an electrolyte; (d) a solubilizer; and (e) a filler; and, (ii) a second part comprising: (a) a curing agen...

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Bibliographische Detailangaben
Hauptverfasser: MOELLER, THOMAS, GREVEY, CHLOE, BRUNSTEDT, BENJAMIN, DIAZ, JORDAN GUTIERREZ, STAPF, STEFANIE
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The present invention is directed to a curable and debondable two-part (2K) hybrid adhesive composition comprising: (i) a first part comprising: (a) epoxy resin; (b) (meth)acrylate monomer; (c) an electrolyte; (d) a solubilizer; and (e) a filler; and, (ii) a second part comprising: (a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; (b) an accelerator; and, (c) a filler.