Adhesive film, laminate, and printed wiring board

To provide an adhesive film that has high adhesiveness with respect to metal substrates and resin substrates such as polyimides, that enables a high solder heat resistance to be achieved, and that provides excellent film handling ability and low-dielectric characteristics. An adhesive film character...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	IRISAWA, HAYATO, KOYANAGI, HIDEYUKI, SONODA, RYO, KAWAKUSU, TETSUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide an adhesive film that has high adhesiveness with respect to metal substrates and resin substrates such as polyimides, that enables a high solder heat resistance to be achieved, and that provides excellent film handling ability and low-dielectric characteristics. An adhesive film characterized by comprising an acid-modified polyolefin (a), an oligophenylene ether (b) that has a number average molecular weight not more than 3000, an epoxy resin (c), and a carbodiimide compound (d), and characterized by containing an organic solvent (e) at an amount of 1-8 mass% with respect to the adhesive film.