Resin sheet and printed circuit board

A resin sheet of the invention comprises a support body and a layer containing a resin composition that is disposed on the surface of the support body, wherein the resin composition includes a cyanate ester compound and/or a phenol compound, and an epoxy compound and/or a maleimide compound, at leas...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUGIMOTO, NORIAKI, KAWASHITA, KAZUAKI, KITAMURA, SHINYA, HIRANO, SYUNSUKE, KOMATSU, KOUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	A resin sheet of the invention comprises a support body and a layer containing a resin composition that is disposed on the surface of the support body, wherein the resin composition includes a cyanate ester compound and/or a phenol compound, and an epoxy compound and/or a maleimide compound, at least one compound from the group consisting of the cyanate ester compound, the phenol compound, the epoxy compound and the maleimide compound includes a compound that has a biphenyl skeleton, the inorganic filler material content of the resin composition in those cases where the resin composition contains an inorganic filler material is 60 parts by mass or less per 100 parts by mass of the resin solid fraction in the resin composition, the Vickers hardness (HV 0.01) of a cured product of the resin composition is at least 10 but not more than 19, and the thickness of the layer containing the resin composition is at least 2 [mu]m but not more than 20 [mu]m.