Sputtering target structure

A sputtering target structure comprises a protecting element, a carrier plate and a target material plate. The carrier plate comprises a carrying surface. The target material plate is on the carrying surface, and comprises at least one sidewall target material surface. The target material plate has...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG, CHENGIA, WU, CHIH-WEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A sputtering target structure comprises a protecting element, a carrier plate and a target material plate. The carrier plate comprises a carrying surface. The target material plate is on the carrying surface, and comprises at least one sidewall target material surface. The target material plate has only the at least one sidewall target material surface having the protecting element disposed thereon.