Thermally-conductive curable composition

Thermally-conductive curable composition

The present disclosure relates to a curable composition comprising: (a) a base component comprising a cationically self-curable silicone-based oligomeric compound; (b) a curing system for the cationically self-curable silicone-based oligomeric compound; and (c) a thermally-conductive filler. Accordi...

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Hauptverfasser: BISSINGER, PETER, STEIGER, WOLF, GOEB, SIEGFRIED RAINER, EICHLER, JENS, GORGOLL, RICARDO MIZOGUCHI, JURJEVIC, SIMONE
Format: Patent
Sprache:chi ; eng
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CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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creator BISSINGER, PETER
STEIGER, WOLF
GOEB, SIEGFRIED RAINER
EICHLER, JENS
GORGOLL, RICARDO MIZOGUCHI
JURJEVIC, SIMONE
description The present disclosure relates to a curable composition comprising: (a) a base component comprising a cationically self-curable silicone-based oligomeric compound; (b) a curing system for the cationically self-curable silicone-based oligomeric compound; and (c) a thermally-conductive filler. According to another aspect, the present disclosure is directed to method of manufacturing a curable composition. In yet another aspect, the disclosure relates to the use of a thermally-conductive curable composition for industrial applications, in particular for thermal management applications in the automotive industry.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202128880A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202128880A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202128880A3</originalsourceid><addsrcrecordid>eNrjZNAIyUgtyk3MyanUTc7PSylNLsksS1VILi1KTMoB0vm5BfnFmSWZ-Xk8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSQ-JNzIwMjQyMLCwsDRmBg1ABxKKSY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermally-conductive curable composition</title><source>esp@cenet</source><creator>BISSINGER, PETER ; STEIGER, WOLF ; GOEB, SIEGFRIED RAINER ; EICHLER, JENS ; GORGOLL, RICARDO MIZOGUCHI ; JURJEVIC, SIMONE</creator><creatorcontrib>BISSINGER, PETER ; STEIGER, WOLF ; GOEB, SIEGFRIED RAINER ; EICHLER, JENS ; GORGOLL, RICARDO MIZOGUCHI ; JURJEVIC, SIMONE</creatorcontrib><description>The present disclosure relates to a curable composition comprising: (a) a base component comprising a cationically self-curable silicone-based oligomeric compound; (b) a curing system for the cationically self-curable silicone-based oligomeric compound; and (c) a thermally-conductive filler. According to another aspect, the present disclosure is directed to method of manufacturing a curable composition. In yet another aspect, the disclosure relates to the use of a thermally-conductive curable composition for industrial applications, in particular for thermal management applications in the automotive industry.</description><language>chi ; eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210801&amp;DB=EPODOC&amp;CC=TW&amp;NR=202128880A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210801&amp;DB=EPODOC&amp;CC=TW&amp;NR=202128880A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BISSINGER, PETER</creatorcontrib><creatorcontrib>STEIGER, WOLF</creatorcontrib><creatorcontrib>GOEB, SIEGFRIED RAINER</creatorcontrib><creatorcontrib>EICHLER, JENS</creatorcontrib><creatorcontrib>GORGOLL, RICARDO MIZOGUCHI</creatorcontrib><creatorcontrib>JURJEVIC, SIMONE</creatorcontrib><title>Thermally-conductive curable composition</title><description>The present disclosure relates to a curable composition comprising: (a) a base component comprising a cationically self-curable silicone-based oligomeric compound; (b) a curing system for the cationically self-curable silicone-based oligomeric compound; and (c) a thermally-conductive filler. According to another aspect, the present disclosure is directed to method of manufacturing a curable composition. In yet another aspect, the disclosure relates to the use of a thermally-conductive curable composition for industrial applications, in particular for thermal management applications in the automotive industry.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAIyUgtyk3MyanUTc7PSylNLsksS1VILi1KTMoB0vm5BfnFmSWZ-Xk8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSQ-JNzIwMjQyMLCwsDRmBg1ABxKKSY</recordid><startdate>20210801</startdate><enddate>20210801</enddate><creator>BISSINGER, PETER</creator><creator>STEIGER, WOLF</creator><creator>GOEB, SIEGFRIED RAINER</creator><creator>EICHLER, JENS</creator><creator>GORGOLL, RICARDO MIZOGUCHI</creator><creator>JURJEVIC, SIMONE</creator><scope>EVB</scope></search><sort><creationdate>20210801</creationdate><title>Thermally-conductive curable composition</title><author>BISSINGER, PETER ; STEIGER, WOLF ; GOEB, SIEGFRIED RAINER ; EICHLER, JENS ; GORGOLL, RICARDO MIZOGUCHI ; JURJEVIC, SIMONE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202128880A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>BISSINGER, PETER</creatorcontrib><creatorcontrib>STEIGER, WOLF</creatorcontrib><creatorcontrib>GOEB, SIEGFRIED RAINER</creatorcontrib><creatorcontrib>EICHLER, JENS</creatorcontrib><creatorcontrib>GORGOLL, RICARDO MIZOGUCHI</creatorcontrib><creatorcontrib>JURJEVIC, SIMONE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BISSINGER, PETER</au><au>STEIGER, WOLF</au><au>GOEB, SIEGFRIED RAINER</au><au>EICHLER, JENS</au><au>GORGOLL, RICARDO MIZOGUCHI</au><au>JURJEVIC, SIMONE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermally-conductive curable composition</title><date>2021-08-01</date><risdate>2021</risdate><abstract>The present disclosure relates to a curable composition comprising: (a) a base component comprising a cationically self-curable silicone-based oligomeric compound; (b) a curing system for the cationically self-curable silicone-based oligomeric compound; and (c) a thermally-conductive filler. According to another aspect, the present disclosure is directed to method of manufacturing a curable composition. In yet another aspect, the disclosure relates to the use of a thermally-conductive curable composition for industrial applications, in particular for thermal management applications in the automotive industry.</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title Thermally-conductive curable composition
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