Thermally-conductive curable composition

The present disclosure relates to a curable composition comprising: (a) a base component comprising a cationically self-curable silicone-based oligomeric compound; (b) a curing system for the cationically self-curable silicone-based oligomeric compound; and (c) a thermally-conductive filler. Accordi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BISSINGER, PETER, STEIGER, WOLF, GOEB, SIEGFRIED RAINER, EICHLER, JENS, GORGOLL, RICARDO MIZOGUCHI, JURJEVIC, SIMONE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure relates to a curable composition comprising: (a) a base component comprising a cationically self-curable silicone-based oligomeric compound; (b) a curing system for the cationically self-curable silicone-based oligomeric compound; and (c) a thermally-conductive filler. According to another aspect, the present disclosure is directed to method of manufacturing a curable composition. In yet another aspect, the disclosure relates to the use of a thermally-conductive curable composition for industrial applications, in particular for thermal management applications in the automotive industry.