Semiconductor device

Embodiments provide a semiconductor device capable of improving reliability. According to the invention, a plurality of semiconductor chips (3) having film-like adhesives (2, 4) attached to back surfaces thereof are laminated on a wiring substrate (1), the wiring substrate (1) is connected to the semiconductor chips and the semiconductor device also comprises a semiconductor chip (3c) to which FOW(4a) is attached, and a semiconductor chip (3b) fixed to the semiconductor chip (3c) via the FOW (4a), and. The front surface of the semiconductor chip (3b) includes a first portion covered by the FOW (4a) and a second portion not covered by the FOW (4a). The semiconductor device further includes a resin (6a) covering the second portion and a side end surface of the FOW (4a) on a front surface of the semiconductor chip (3b).