Development processing method and development processing device

To reduce the number of defects when a resist film having a large angle of contact to water is formed. Provided is a development processing method for processing a resist film on a substrate to develop, including: a step (A) for supplying a developer to the substrate to develop the resist film and forming a resist pattern; a step (B) for supplying a water-based cleaning liquid to the substrate having been developed and cleaning the substrate with the water-based cleaning liquid; a step (C) for applying an aqueous solution of water-soluble polymer to the substrate having been cleaned with the water-based cleaning liquid and forming a hydrophilic layer having hydrophilicity on the surface of the substrate; a step (D) for cleaning the substrate having had the hydrophilic layer formed thereon with a rinse liquid. The step (B) includes a step (a) for accelerating the number of revolutions of the substrate and a step (b) for decelerating the number of revolutions of the substrate for a while before the step (C) is