Sub-field control of a lithographic process and associated apparatus

Disclosed is a method for determining a correction for control of a lithographic process for exposing a pattern on an exposure field using a lithographic apparatus. The method comprises obtaining a spatial profile describing spatial variation of a performance parameter across at least a portion of t...

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Bibliographische Detailangaben
Hauptverfasser:	KATTOUW, HANS ERIK, THIJSSEN, THEO WILHELMUS MARIA, KLINKHAMER, JACOB FREDRIK FRISO, ALTINI, VALERIO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	Disclosed is a method for determining a correction for control of a lithographic process for exposing a pattern on an exposure field using a lithographic apparatus. The method comprises obtaining a spatial profile describing spatial variation of a performance parameter across at least a portion of the exposure field and co-determining control profiles for the spatial profile to minimize error in the performance parameter while ensuring a minimum contrast quality. The co-determined control profiles comprise at least a stage control profile for control of a stage arrangement of the lithographic apparatus and a lens manipulator control profile for control of a lens manipulator of the lithographic apparatus operable to perform a correction for at least magnification in a direction perpendicular to the substrate plane.