Method for improving ability of indium bismuth alloy to wet substrate and complex made by the method

A method for improving ability of an indium bismuth alloy to wet a substrate includes providing a polymer interface layer comprising carboxylic acid between the substrate and the indium bismuth alloy; heating the indium bismuth alloy at a temperature above a melting point thereof and joining the liq...

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Bibliographische Detailangaben
Hauptverfasser:	YANG, FU-AN, HUANG, PO-YEN, YANG, YONG-REN, WANG, JENN-SHING, SHEN, BO-KAI, WANG, JIE-YONG, CHEN, ZHI-QI, HONG, JIA-JUN, HUANG, ZHE-WEN, CHEN, XIN-ZAI, XIAO, YI-TING, WU, JUN-YI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING USE OF MATERIALS THEREFOR WELDING WOODSTAINS WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for improving ability of an indium bismuth alloy to wet a substrate includes providing a polymer interface layer comprising carboxylic acid between the substrate and the indium bismuth alloy; heating the indium bismuth alloy at a temperature above a melting point thereof and joining the liquefied indium bismuth alloy and the substrate; and cooling the indium bismuth alloy until the temperature thereof is below the melting point to bind the solidified indium bismuth alloy and the substrate together. The embodiments also disclose a complex produced by the method. The polymer interface layer comprising carboxylic acid enhances the ability of the indium bismuth alloy to wet and join with the substrate, and inhibits overflow of the liquefied indium bismuth alloy.