Method of manufacturing structures on substrates using wet deposition

The invention relates to a method of manufacturing structures on substrates using wet deposition wherein a first dielectric layer is deposited on a substrate by wet deposition, a first electrically conductive layer is deposited on the first dielectric layer, a second dielectric layer is deposited on...

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Bibliographische Detailangaben
Hauptverfasser:	NEUMANN, KARSTEN, RUCKMICH, STEFAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY FREQUENCY-CHANGING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	The invention relates to a method of manufacturing structures on substrates using wet deposition wherein a first dielectric layer is deposited on a substrate by wet deposition, a first electrically conductive layer is deposited on the first dielectric layer, a second dielectric layer is deposited on it by wet deposition, and a second electrically conductive layer is deposited on it. The objective of the invention is, to enable the use of wet deposition in that it avoids short circuits between electrically conductive layers to achieve an acceptable yield and reliability even if relatively large particles or unevenness are present on a substrate. The objective of the invention is solved by conformally depositing a dielectric interlayer between the first dielectric layer and the second electrically conductive layer by a dry deposition process.