Electronic load device and heat-dissipating load module

The present invention discloses an electronic load device and a heat-dissipating load module. The electronic load device comprises a main board, having a plurality of first connecting ports, and a load module, comprising a sub board and a heat-dissipating unit. The sub board has a second connecting...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG, CHIEN-HSING, CHOU, CHIEN-JIU, LIU, CHUNG-LIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention discloses an electronic load device and a heat-dissipating load module. The electronic load device comprises a main board, having a plurality of first connecting ports, and a load module, comprising a sub board and a heat-dissipating unit. The sub board has a second connecting port, detachably connecting with one of the plurality of first connecting ports, and a pin slot, connecting with a power component. The heat-dissipating unit has a cylindrical body and a plurality of heat-dissipating fins. An outer surface and an inner surface are defined on the cylindrical body. The plurality of heat-dissipating fins connect with the outer surface, and the power component contacts the inner surface while being mounted at the pin slot.