Picking apparatus and the method using the same

A picking apparatus is used for picking up a plurality of microelements. The picking apparatus includes an elastic plate, a base plate, a temperature-controlled adhesive layer, as least one heating element and a power source. The elastic plate has a first surface and a second surface opposite to eac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LEE, YUUN, CHEN, FU-HSIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	A picking apparatus is used for picking up a plurality of microelements. The picking apparatus includes an elastic plate, a base plate, a temperature-controlled adhesive layer, as least one heating element and a power source. The elastic plate has a first surface and a second surface opposite to each other. The base plate is disposed on the first surface. The temperature-controlled adhesive layer is disposed on the second surface and is configured to adhere with the microelements. The heating element is disposed between the second surface and the temperature-controlled adhesive layer. The power source is electrically connected with the heating element. The viscosity of the temperature-controlled adhesive layer varies with the temperature of the temperature-controlled adhesive layer.