Sputtering device capable of effectively suppressing disappearance of an anode when a dielectric film is formed by sputtering of a target material

The subject of the invention is to provide a sputtering device that can effectively suppress disappearance of an anode for a long time when a dielectric film is formed by sputtering of a target material. The solution of the invention is a sputtering device (SM), which includes a vacuum chamber (1) p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARAYA, TAKUMA, HOSODA, IKUO, IWAI, HARUNORI, FUJINAGA, TETSUSHI, GOUSHI, YOSHITAKA, HARADA, MANABU, IKEDA, SUSUMU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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