Sputtering device capable of effectively suppressing disappearance of an anode when a dielectric film is formed by sputtering of a target material

The subject of the invention is to provide a sputtering device that can effectively suppress disappearance of an anode for a long time when a dielectric film is formed by sputtering of a target material. The solution of the invention is a sputtering device (SM), which includes a vacuum chamber (1) provided with a target material (2) and a sputtering power supply (Ps), wherein a specific power is input to the target material, through inputting power to the target material, a plasma atmosphere is formed in the vacuum chamber, and the target material is sputterted so that a dielectric film is formed on the surface of a substrate in the vacuum chamber, a ring member (3) functioning as an anode during the sputtering is disposed in such a manner that it is around the surrounding of the target material, the ring member is disposed so that an upper surface (30) of the ring member is positioned lower than a sputtering surface (2a) of the target material; in addition, an anti-adhesion plate (6) is provided and arranged