Biaxially oriented polyarylene sulfide film

The present invention addresses the problem of providing a biaxially oriented polyarylene sulfide film having exceptional thermal dimensional stability, processability, and transmission characteristics. A biaxially oriented polyarylene sulfide film having a structural component composed mainly of a...

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Bibliographische Detailangaben
Hauptverfasser:	HAMASAKI, RISA, FUKUDA, KAZUTOMO, TAKAHASHI, KENTA, MAEKAWA, SHIGETOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention addresses the problem of providing a biaxially oriented polyarylene sulfide film having exceptional thermal dimensional stability, processability, and transmission characteristics. A biaxially oriented polyarylene sulfide film having a structural component composed mainly of a polyarylene sulfide (PAS) resin and having a melting start temperature (Tms) and a melting point (Tm), measured in the first run under conditions of a heating rate of 20 DEG C/min and a sample quantity of 5 mg using differential scanning calorimetry (DSC), that satisfy expression (1). Expression (1): 20 DEG C ≤ Tm - Tms ≤ 100 DEG C.