Cross section imaging with improved 3D volume image reconstruction accuracy

The present invention relates to a three-dimensional circuit pattern inspection technique by cross sectioning of integrated circuits and, more particularly, to a method, computer program product and apparatus for obtaining a 3D volume image of an integrated semiconductor sample. The method employs a...

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Bibliographische Detailangaben
Hauptverfasser:	NEUMANN, JENS TIMO, AVISHAI, AMIR, BUXBAUM, ALEX, SCHULMEYER, INGO, FOCA, EUGEN, KLOCHKOV, DMITRY, LEE, KEUM-SIL, KORB, THOMAS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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Beschreibung
Zusammenfassung:	The present invention relates to a three-dimensional circuit pattern inspection technique by cross sectioning of integrated circuits and, more particularly, to a method, computer program product and apparatus for obtaining a 3D volume image of an integrated semiconductor sample. The method employs a feature based alignment of cross section images based on features of an integrated semiconductor sample.