Chip package using silicon interposer as interconnection bridge

Chip package using silicon interposer as interconnection bridge

A chip package using silicon interposer as interconnection bridge lifts multi-dies above the fan-out molding package embedded with premade Si interposer interconnection bridge under the multi-die space. The interconnection bridge connects the multi-dies through fine pitch high I/O interconnection. A...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHANGCHIEN, SHANG-YU, HSU, HUNG-HSIN, TSAI, PEIUN, LIN, NANUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A chip package using silicon interposer as interconnection bridge lifts multi-dies above the fan-out molding package embedded with premade Si interposer interconnection bridge under the multi-die space. The interconnection bridge connects the multi-dies through fine pitch high I/O interconnection. A first RDL and a second RDL are further disposed on top side and bottom side of the fan-out molding package, further providing connection for the multi-dies to a substrate via the coonection routing inside the fan-out molding package.