Large-size thin-film deposition substrate and method for manufacturing same, segmented thin-film deposition substrate and method for manufacturing same, and production management method and production management system thereof
Provided is a method for manufacturing a large-size thin-film deposition substrate with which it is possible to reduce manufacturing costs of a large-size thin-film deposition substrate and segmented thin-film deposition substrates which include identification marks, and to improve precision in read...
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creator | ASATANI, TSUYOSHI |
description | Provided is a method for manufacturing a large-size thin-film deposition substrate with which it is possible to reduce manufacturing costs of a large-size thin-film deposition substrate and segmented thin-film deposition substrates which include identification marks, and to improve precision in reading said identification marks. The method for manufacturing a large-size thin-film deposition substrate comprises: a marking step of marking at least one identification mark M for each segmented region which is segmented by a dicing line L on one primary surface side of a pre-dicing large-size substrate 11; and a thin-film deposition step of generating a large-size thin-film deposition substrate 2 by thin-film deposition on the large-size substrate 11 except for the position of the identification mark M. In the marking step, one marking device with a markable region A1 smaller than the large-size substrate 11 is used to simultaneously mark all of the identification marks M on the large-size substrate 11 such that w |
format | Patent |
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The method for manufacturing a large-size thin-film deposition substrate comprises: a marking step of marking at least one identification mark M for each segmented region which is segmented by a dicing line L on one primary surface side of a pre-dicing large-size substrate 11; and a thin-film deposition step of generating a large-size thin-film deposition substrate 2 by thin-film deposition on the large-size substrate 11 except for the position of the identification mark M. 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The method for manufacturing a large-size thin-film deposition substrate comprises: a marking step of marking at least one identification mark M for each segmented region which is segmented by a dicing line L on one primary surface side of a pre-dicing large-size substrate 11; and a thin-film deposition step of generating a large-size thin-film deposition substrate 2 by thin-film deposition on the large-size substrate 11 except for the position of the identification mark M. In the marking step, one marking device with a markable region A1 smaller than the large-size substrate 11 is used to simultaneously mark all of the identification marks M on the large-size substrate 11 such that w</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS HANDLING RECORD CARRIERS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS REGULATING SEMICONDUCTOR DEVICES |
title | Large-size thin-film deposition substrate and method for manufacturing same, segmented thin-film deposition substrate and method for manufacturing same, and production management method and production management system thereof |
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