Method for producing electrolytic copper foil

The present invention relates to a method for producing an electrolytic copper foil, whereby it becomes possible to provide an electrolytic copper foil which has an electric conductivity of 99% or more and a thickness of 10 [mu]m or less, rarely undergoes a warpage problem, and has smooth front and...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: OGURO, RYOICHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates to a method for producing an electrolytic copper foil, whereby it becomes possible to provide an electrolytic copper foil which has an electric conductivity of 99% or more and a thickness of 10 [mu]m or less, rarely undergoes a warpage problem, and has smooth front and rear surfaces, tensile strength of 500 Mpa or more and an elongation ratio of 5.5% or more. According to the method, in the formation of an electrolytic copper foil using, as an electrolyte solution, an aqueous (sulfuric acid)-(copper sulfate) solution that does not contain a heavy metal other than metal copper and using an insoluble anode and a cathode drum that faces the insoluble anode, and by allowing a direct current to flow between the both electrodes to form the electrolytic copper foil, specific additives (A) to (E) are contained at specified amounts in the electrolyte solution, wherein the additives (D) and (A) are added at a (D)/(A) ratio of 0.2 to 0.7.