Method of modifying a textured glass substrate with a region under compressive stress to increase strength of the glass substrate

A method of modifying a glass substrate comprises: generating surface features with peaks and valleys on a first surface of a glass substrate, the surface features providing a roughness average (Ra) within the range of 10 nm to 2000 nm; generating a region of the glass substrate that is under compressive stress, the region extending from the first surface to a depth of compression; and removing a portion of the region under compressive stress from the first surface into the depth of compression to define a new first surface still having surface features with peaks and valleys providing a roughness average (Ra) within the range of 10 nm to 2000 nm. Removing the portion of the region under compressive stress from the first surface into the depth of the compression to define a new first surface can comprise contacting the first surface with a light etchant.