Tape for electronic component and method of processing electronic component

Provided are a tape for an electronic component and a method of processing an electronic component, which can sufficiently follow a semiconductor wafer having a bump with a large height and can prevent a dimple from occurring on the ground surface of the semiconductor wafer. The tape 1 for an electr...

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Bibliographische Detailangaben
1. Verfasser:	OKURA, MASATO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided are a tape for an electronic component and a method of processing an electronic component, which can sufficiently follow a semiconductor wafer having a bump with a large height and can prevent a dimple from occurring on the ground surface of the semiconductor wafer. The tape 1 for an electronic component according to the present invention is characterized in that the tape 1 has at least one resin layer 3, the resin layer 3 has a storage modulus of 10000 to 200000 Pa at any temperature of 60 DEG C to 80 DEG C, and the melt flow rate is 10 g/10 min to 200 g/10 min.