Retaining ring

A retaining ring for chemical mechanical polishing process is provided. The retaining ring includes a first portion and a second portion. The second portion disposed on the first portion has a first surface and a second surface opposite to each other, wherein the first surface of the second portion...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHEN, MING-HUNG, CHEN, SHIH-HSI, YEN, SHIH-CI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A retaining ring for chemical mechanical polishing process is provided. The retaining ring includes a first portion and a second portion. The second portion disposed on the first portion has a first surface and a second surface opposite to each other, wherein the first surface of the second portion has a plurality of first trenches, and the second surface of the second portion is adjacent to the first portion. A bump between two adjacent trenches has a hole disposed therein.