Laser processing method and laser processing device capable of detecting a hole being penetrated by detecting that the light detection level on the end surface of the substrate has been decreased to a predetermined level

An object of the invention is to detect a hole being penetrated, especially when the hole is bored in a glass substrate with laser. To achieve the object, a laser processing device is provided, which includes: a workbench on which a substrate to be processed is loaded; a laser irradiation system for...

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Hauptverfasser: SAEKI, YUKI, ITO, YASUSHI, NISHIBE, TATSUYA, ICHIKAWA, KENICHI
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Sprache:chi ; eng
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creator SAEKI, YUKI
ITO, YASUSHI
NISHIBE, TATSUYA
ICHIKAWA, KENICHI
description An object of the invention is to detect a hole being penetrated, especially when the hole is bored in a glass substrate with laser. To achieve the object, a laser processing device is provided, which includes: a workbench on which a substrate to be processed is loaded; a laser irradiation system for irradiating a laser beam to the substrate; and a control unit for controlling various parts of a device so as to conduct a processing operation, wherein the control unit detects the hole being penetrated by detecting that the light detection level on the end surface of the substrate has been decreased to a predetermined level during the processing operation.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Laser processing method and laser processing device capable of detecting a hole being penetrated by detecting that the light detection level on the end surface of the substrate has been decreased to a predetermined level
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