Laser processing method and laser processing device capable of detecting a hole being penetrated by detecting that the light detection level on the end surface of the substrate has been decreased to a predetermined level

An object of the invention is to detect a hole being penetrated, especially when the hole is bored in a glass substrate with laser. To achieve the object, a laser processing device is provided, which includes: a workbench on which a substrate to be processed is loaded; a laser irradiation system for...

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Bibliographische Detailangaben
Hauptverfasser:	SAEKI, YUKI, ITO, YASUSHI, NISHIBE, TATSUYA, ICHIKAWA, KENICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An object of the invention is to detect a hole being penetrated, especially when the hole is bored in a glass substrate with laser. To achieve the object, a laser processing device is provided, which includes: a workbench on which a substrate to be processed is loaded; a laser irradiation system for irradiating a laser beam to the substrate; and a control unit for controlling various parts of a device so as to conduct a processing operation, wherein the control unit detects the hole being penetrated by detecting that the light detection level on the end surface of the substrate has been decreased to a predetermined level during the processing operation.