Bonding device, frame feeder, and heater unit

To improve productivity. A wire bonding device 1 includes a bonding tool 7 for wire bonding to a lead frame 100, and a frame feeder 2 that conveys the lead frame 100 by a rail 9 and preheats the lead frame 100 by a preheater 11. The preheater 11 includes a cartridge heater 14 and a heater block 16 t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAGANO, KAZUAKI, MIYACHIKA, TAKAMASA, KOJIMA, MASATO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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