Bonding device, frame feeder, and heater unit
To improve productivity. A wire bonding device 1 includes a bonding tool 7 for wire bonding to a lead frame 100, and a frame feeder 2 that conveys the lead frame 100 by a rail 9 and preheats the lead frame 100 by a preheater 11. The preheater 11 includes a cartridge heater 14 and a heater block 16 t...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | To improve productivity. A wire bonding device 1 includes a bonding tool 7 for wire bonding to a lead frame 100, and a frame feeder 2 that conveys the lead frame 100 by a rail 9 and preheats the lead frame 100 by a preheater 11. The preheater 11 includes a cartridge heater 14 and a heater block 16 that is arranged on the upstream side of a bonding area A2 in the transport direction D1 of the lead frame 100 and that provides the lead frame 100 with the heat received from the cartridge heater 14. The heater block 16 is provided with a plurality of fins 22 extending in the facing direction D2. |
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