CMP particle and CMP slurry composition

The present invention provides a chemical-mechanical polishing particle having high polishing quality with a high polishing rate and few defects or scratches by modifying the surface of a polishing particle, and a polishing slurry composition comprising same.

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Bibliographische Detailangaben
Hauptverfasser:	JIN, SUNG-HOON, LEE, MIN-GUN, JEON, SEUNG-HUN, YOO, JAE-HONG, PARK, JONG-DAI, CHO, GYEONG-SOOK, BYUN, KYUNG-ROCK, PARK, HYE-JUNG, KIM, JAE-HYUN, LEE, GOO-HWA, MOON, WEOUN-GYUEN, SHIN, KYU-SOON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides a chemical-mechanical polishing particle having high polishing quality with a high polishing rate and few defects or scratches by modifying the surface of a polishing particle, and a polishing slurry composition comprising same.