Two-side polishing device

The present invention is a two-side polishing device equipped with: a lower platen that is provided so as to be rotatable about a rotating shaft and that has a polishing pad affixed to an upper surface thereof; an upper platen that is provided above the lower platen so as to be movable up and down a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA, YUKI, MARUTA, MASASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention is a two-side polishing device equipped with: a lower platen that is provided so as to be rotatable about a rotating shaft and that has a polishing pad affixed to an upper surface thereof; an upper platen that is provided above the lower platen so as to be movable up and down and rotatable about the rotating shaft and that has a polishing pad affixed to a lower surface thereof; and a suspended top that is provided above the upper platen. The two-side polishing device is characterized by comprising: a connecting part that connects the suspended top and the upper platen; and an actuator that is provided between the suspended top and the upper platen, in a position different from the connecting part, and that is capable of deforming the shape of the upper platen. Due to this configuration, a platen moving mechanism is provided that enables the shape of a platen to be deformed into various shapes without promoting thermal deformation of the platen in a duplex polishing device in a suspended