Multi-device packaging structure and manufacturing method thereof

Multi-device packaging structure and manufacturing method thereof

The present disclosure provides a multi-device packaging structure and a manufacturing method thereof. The multi-device packaging structure includes: a substrate; a control device and a pressure sensing device arranged on a side of the substrate; a packaging housing positioned on the side of the sub...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CAI, FANG-SONG, NING, SHIAO, CHENG, YONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CAI, FANG-SONG
NING, SHIAO
CHENG, YONG
description The present disclosure provides a multi-device packaging structure and a manufacturing method thereof. The multi-device packaging structure includes: a substrate; a control device and a pressure sensing device arranged on a side of the substrate; a packaging housing positioned on the side of the substrate, wherein a cavity is defined in the packaging housing, and at least part of a sensing area of the pressure sensing device is exposed out of a bottom of the cavity. At least one corner of a side wall of the cavity is a chamfer structure. The present disclosure may improve the manufacturing yield of the multi-device packaging structure.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202044428A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202044428A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202044428A3</originalsourceid><addsrcrecordid>eNrjZHD0Lc0pydRNSS3LTE5VKEhMzk5Mz8xLVyguKSpNLiktSlVIzEtRyE3MK01LBPFBcrmpJRn5KQolGalFqflpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tRhoZGpeakl8SLiRgZGBiYmJkYWjMTFqAEpJMmM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Multi-device packaging structure and manufacturing method thereof</title><source>esp@cenet</source><creator>CAI, FANG-SONG ; NING, SHIAO ; CHENG, YONG</creator><creatorcontrib>CAI, FANG-SONG ; NING, SHIAO ; CHENG, YONG</creatorcontrib><description>The present disclosure provides a multi-device packaging structure and a manufacturing method thereof. The multi-device packaging structure includes: a substrate; a control device and a pressure sensing device arranged on a side of the substrate; a packaging housing positioned on the side of the substrate, wherein a cavity is defined in the packaging housing, and at least part of a sensing area of the pressure sensing device is exposed out of a bottom of the cavity. At least one corner of a side wall of the cavity is a chamfer structure. The present disclosure may improve the manufacturing yield of the multi-device packaging structure.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201201&amp;DB=EPODOC&amp;CC=TW&amp;NR=202044428A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201201&amp;DB=EPODOC&amp;CC=TW&amp;NR=202044428A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CAI, FANG-SONG</creatorcontrib><creatorcontrib>NING, SHIAO</creatorcontrib><creatorcontrib>CHENG, YONG</creatorcontrib><title>Multi-device packaging structure and manufacturing method thereof</title><description>The present disclosure provides a multi-device packaging structure and a manufacturing method thereof. The multi-device packaging structure includes: a substrate; a control device and a pressure sensing device arranged on a side of the substrate; a packaging housing positioned on the side of the substrate, wherein a cavity is defined in the packaging housing, and at least part of a sensing area of the pressure sensing device is exposed out of a bottom of the cavity. At least one corner of a side wall of the cavity is a chamfer structure. The present disclosure may improve the manufacturing yield of the multi-device packaging structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0Lc0pydRNSS3LTE5VKEhMzk5Mz8xLVyguKSpNLiktSlVIzEtRyE3MK01LBPFBcrmpJRn5KQolGalFqflpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tRhoZGpeakl8SLiRgZGBiYmJkYWjMTFqAEpJMmM</recordid><startdate>20201201</startdate><enddate>20201201</enddate><creator>CAI, FANG-SONG</creator><creator>NING, SHIAO</creator><creator>CHENG, YONG</creator><scope>EVB</scope></search><sort><creationdate>20201201</creationdate><title>Multi-device packaging structure and manufacturing method thereof</title><author>CAI, FANG-SONG ; NING, SHIAO ; CHENG, YONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202044428A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CAI, FANG-SONG</creatorcontrib><creatorcontrib>NING, SHIAO</creatorcontrib><creatorcontrib>CHENG, YONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CAI, FANG-SONG</au><au>NING, SHIAO</au><au>CHENG, YONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multi-device packaging structure and manufacturing method thereof</title><date>2020-12-01</date><risdate>2020</risdate><abstract>The present disclosure provides a multi-device packaging structure and a manufacturing method thereof. The multi-device packaging structure includes: a substrate; a control device and a pressure sensing device arranged on a side of the substrate; a packaging housing positioned on the side of the substrate, wherein a cavity is defined in the packaging housing, and at least part of a sensing area of the pressure sensing device is exposed out of a bottom of the cavity. At least one corner of a side wall of the cavity is a chamfer structure. The present disclosure may improve the manufacturing yield of the multi-device packaging structure.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW202044428A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Multi-device packaging structure and manufacturing method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T07%3A33%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CAI,%20FANG-SONG&rft.date=2020-12-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202044428A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true