Multi-device packaging structure and manufacturing method thereof
The present disclosure provides a multi-device packaging structure and a manufacturing method thereof. The multi-device packaging structure includes: a substrate; a control device and a pressure sensing device arranged on a side of the substrate; a packaging housing positioned on the side of the sub...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present disclosure provides a multi-device packaging structure and a manufacturing method thereof. The multi-device packaging structure includes: a substrate; a control device and a pressure sensing device arranged on a side of the substrate; a packaging housing positioned on the side of the substrate, wherein a cavity is defined in the packaging housing, and at least part of a sensing area of the pressure sensing device is exposed out of a bottom of the cavity. At least one corner of a side wall of the cavity is a chamfer structure. The present disclosure may improve the manufacturing yield of the multi-device packaging structure. |
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